Dongguan Lanbo Electronics Technology Co., Ltd.

MX 3.96mm Wafer R/A Dip Type without Lock
MX 3.96mm Wafer R/A Dip Type without Lock
  • MX 3.96mm Wafer R/A Dip Type without Lock

  • Part No : WF1R396-XX-01
  • Specifications
    Current Rating: 7.0A AC/DC
    Voltage Rating: 250V AC/DC
    Contact Resistance: 10m ohm. Max
    Insulation Resistance: 1000Mohm min
    Withstanding Voltage: 1500V(r.m.s) For one Minute
    Operating Temperature Range: -40°C ~ +85°C
    Insulator: High Temp. Plastic(Nylon 66 UL94V-2)
    Color: White
    Contact: Copper Alloy
    Plated: Tin Plated

  • Inquiry now
  • Products Drawing

Detailed description

The wire-to-board connector offers seamless electrical integration. With precision design, it ensures reliable connections, making it essential for diverse applications that demand efficient and stable connectivity.

Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.

Send us your question about this product