Dongguan Lanbo Electronics Technology Co., Ltd.

  • Molex Nano fit 2.5mm Wafer Straight Dip Type

  • Part No : WFV25-XX
    • Specifications
      Current Rating:3.0A AC/DC
      Voltage Ratinge:250V AC/DC
      Contact Resistance:20m ohm. Max
      Insulation Resistance:1000Mohm min
      Withstanding Voltage:500V(r.m.s) For one Minute

      Operating Temperature Range:-40°C ~ +105°C


      Insulator:High Temp. Plastic(Nylon 66 UL94V-0)
      Conact :Copper Alloy

      Plated:Tin Plated

  • Inquiry now

Detailed description

Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.

Send us your question about this product